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    半导体设备

    In semiconductor wafer handling equipment, micro compression springs are commonly used for the wafer suction cups at the end of the robotic arm. By accurately controlling the suction force with elastic force, they prevent the wafer (especially ultra-thin wafers) from being damaged or unstable due to excessive pressure, ensuring the safety and stability of the handling process;
    In the precision transmission mechanism of lithography equipment, disc springs can eliminate component gaps, improve motion accuracy, ensure that the relative position error between the lithography lens and the wafer is controlled at the micrometer level, and provide support for the precision of chip lithography patterns;
    In semiconductor packaging testing equipment, the contact spring of the probe card can maintain stable contact pressure between the probe and the chip pins, ensure smooth transmission of electrical signals, ensure accurate test data, and avoid excessive wear of the probe, thereby extending its service life;
    High temperature process equipment in semiconductor manufacturing, such as thin film deposition equipment, uses high-temperature resistant alloy springs as the clamping mechanism for sealing doors, which can maintain stable elasticity in high temperature environments, ensuring the sealing of the equipment's internal vacuum or inert gas environment and avoiding external interference to the process.
     
    Application System Specific Products Common Materials Core Performance Requirements
    Wafer Transmission & Positioning Wafer clamping spring, lithography machine return spring, vacuum support elastic parts SUS304/316L, 82B ultra-pure piano wire Low dust emission, vacuum compatibility, stable elasticity, high cleanliness
    Chip Testing System Probe card spring, PogoPin test spring, test socket elastic assembly C17200 beryllium copper, SUS301, 17-7PH High conductivity, non-magnetic, arc resistance, long cycle service life
    Thin Film Deposition Equipment Chamber sealing wave spring, nozzle compression spring, electrode contact spring Inconel X-750, SUS631 High temperature resistance, plasma corrosion resistance, stress relaxation resistance
    Etching & Cleaning Equipment Electrostatic chuck fixing spring, spray balancing spring, anti-corrosion elastic parts SUS316L, Hastelloy C-276, titanium alloy Strong acid corrosion resistance, no particle shedding, suitable for chemical working conditions
    Precision Optical Module Optical anti-shock spring, micro adjustment elastic part, shock absorption fixing spring 3J22 cobalt-based alloy, high-purity spring steel Small deformation, high precision, low hysteresis, stable operation
    Power Module Module compression spring, conductive contact spring, heat dissipation compensation part CuBe2 copper alloy, SUS631 Excellent electric and thermal conductivity, thermal cycle impact resistance

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